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HyperRAM™ & Octal xSPI psuedostatic RAM (pSRAM) Memory | Cypress Semiconductor

HyperRAM™ & Octal xSPI psuedostatic RAM (pSRAM) Memory

HyperRAM™ pseudo static self-refresh RAMs (pSRAM)

Infineon’s Hyperram™ in Ball grid array package
HyperBus (x8) | Octal xSPI (x8)

 

HYPERRAM™ is a stand-alone pSRAM based volatile memory that offers you an easy and inexpensive way to add more RAM to your applications. These low-power devices have high performance and low pin-count, making them ideal for applications requiring external RAM for buffering data, audio, images, video or as a scratchpad for math and data-intensive operations. These devices are available from 64 Mbit up to 512 Mbit in density and support JEDEC compliant HyperBus and Octal xSPI interfaces.

  • 64Mb
  • 128Mb
  • 256Mb
  • 512Mb
  • Instrument Clusters, Infotainment, ADAS, Telematics
  •  Infrared Cameras, Thermal Cameras, Low resolutions machine vision
  • Industrial Robots, Factory Automation, PLC
  • Thermostats, HMI, Smart Speakers
  • AR/VR devices, Smart wtaches, wearables
  • Industrial IoT, IoT Gateways, AIOT, IoT Modules

Small Form Factor

Small Form Factor

FBGA package to ensure small PCB footprint

Low Pin-Count

Low Pin-Count

Low pin-count to aid design simplicity and reduce system cost

Low Power

Low Power

Hybrid sleep mode and partial array refresh for energy efficiency

High Throughput

High Throughput

High read/write bandwidth to maximize system performance

 

HYPERRAM™ Family

The first generation of HyperRAM products were launched in 2017. HyperRAM 2.0 is the second generation of HyperRAM products and support higher throughputs of upto 400MBps and lower power consumption. HyperRAM 2.0 products are now available in densities ranging from 64Mb to 512Mb and supports Octal extended SPI interface (Octal xSPI RAM products) in addition to the HyperBus interface. HyperRAM is AEC-Q100 qualified and support Industrial and Automotive temperature grades upto 125C.

Speed and Density of Hyperram™ 1.0 and Hyperram™ 2.0

256Mb & 512Mb HyperRAM™ sampling now! Order your samples

HyperBus™ Interface

HyperRAM devices are able to achieve high bandwidth compared to traditional parallel expansion memories via the HyperBus Interface. The HyperBus interface utilizes a high-speed 8-bit DDR interface for both address and data along with a differential clock, a read/write latch signal, and a chip select. Both HyperBus and the Octal xSPI interfaces are JEDEC compliant.

HyperBus can also support external NOR flash and RAM on the same bus, and works with any microcontroller with a HyperBus compatible peripheral interface. Visit our HyperBus memories page to know more about HyperFlash memory and HyperRAM + HyperFlash Multi-chip package (MCP) solutions.

Block diagram of Hyperram™ interfacing with MCU/FPGA

To understand how the HyperRAM™ enables a low-pin expansion memory solution, read this whitepaper.

HyperRAM vs competing expansion memory solutions

HyperRAM products achieve far higher throughput per pin compared to competing technologies such as traditional pSRAMs and SDR DRAMs which are based on a parallel interface. The in-built self-refresh circuitry and low-power features such as partial array refresh and hybrid sleep enable lower power consumption making HyperRAM apt for power constrained applications such as wearables and IoT devices.

Feature HyperRAM ADMUX pSRAM SDR DRAM
#Pins Low High High
Throughput Medium-High Low-Medium Low-High
Power Low Medium High
Package Size Small Large Large

About Infineon RAM Memory Solutions

With over 3 decades of leadership in the memory business, Infineon offers a broad portfolio of volatile and non-volatile memories. Our volatile memory offerings include Synchronous and Asynchronous SRAMs for the lower densities and HyperRAMs for the higher densities. Our non-volatile portfolio includes F-RAM and nvSRAM products.

Infineon Products

  1. Watch the Introduction to HyperRAM™ 2.0 video
  2. Read:
  3. Get and overview of the product features
  4. Understand the product applications
  5. Download the Datasheets for:
    • Octal xSPI RAM
    • HyperRAM™ 2.0
  6. Read:
  7. Use the Product Selector to select the appropriate product
  8. Order your sample
  9. Get your schematics reviewed by the Cypress Applications Engineering Team using Cypress Developer Community
Features HyperRAM™ 1.0 (KL-1/KS-1) HyperRAM™ 2.0 (KL-2/KS-2) Octal xSPI RAM (KL-3/KS-3)
Product Selector Guide
Density 64Mb, 128Mb 64Mb, 128Mb, 256Mb, 512Mb 64Mb, 128Mb, 256Mb, 512Mb
Operating Voltage

1.8V

3.0V

1.8V

3.0V (only 64Mb, 128Mb)

1.8V

3.0V (only 64Mb, 128Mb)

Interface

HyperBus

(JEDEC JESD251 Profile 2.0)

HyperBus

(JEDEC JESD251 Profile 2.0)

Octal xSPI

(JEDEC JESD251 Profile 1.0)

Data Bus Width 8-bit (x8) 8-bit (x8) 8-bit (x8)
Frequency, Throughput   200 Mhz, 400 MBps 200 MHz, 400 MBps
Temperature Range

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Automotive Grade 1, -40°C to +125°C

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Packages 48mm2, 24-ball BGA 48mm2, 24-ball BGA 48mm2, 24-ball BGA
Active Current (max) 60 mA (1.8V), 35 mA (3.0V) 25 mA (1.8V), 30 mA (3.0V) 25 mA (1.8V), 30 mA (3.0V)
Standby Current (max) 200 μA (1.8V), 300 μA (3.0V) 220 μA (1.8V), 250 μA (3.0V) 220 μA (1.8V), 250 μA (3.0V)
Deep Power Down (Max No Refresh Current) 10 μA (1.8V), 20 μA (3.0V) 10 μA (1.8V), 12 μA (3.0V) 10 μA (1.8V), 12 μA (3.0V)
Hybrid Sleep (Typ. Self Refresh Current) NA 25 μA (1.8V), 35 μA (3.0V) 25 μA (1.8V), 35 μA (3.0V)
Partial Array Refresh Yes Yes Yes
Datasheet

HyperRAM™ and Octal xSPI RAM self-refresh DRAMs

Applications of HyperRAM™

HyperRAM’s high throughput, low pin-count, smaller footprint and energy efficiency makes it as an ideal expansion memory choice for a variety of automotive, industrial and communication applications.

Hyperram™ and Hyperflash™ requires only 13 pins to interface with MCU compared to 41 pin in traditional NOR Flash and SDR DDRAM.

HyperRAM shares a common footprint with xSPI-based (HyperBus and Octal xSPI interfaces) NOR Flash ranging from 128Mb to 4Gb densities. Operating on a single HyperBus or Octal xSPI interface for both RAM and Flash simplifies system designs and reduces pin count consumption of the host controller significantly when compared to traditional embedded system designs.

Automotive Instrument cluster

Automotive Instrument clusters provide drivers a centralized and easily viewable location for displaying all critical automobile information. Today’s instrument clusters provide graphical gauge readouts on large, high resolution color displays. The use of advanced 2D and 3D graphics in user interface designs is becoming steadily more prevalent and more sophisticated. The instrument cluster system in a vehicle informs critical driving information to the driver and hence it is imperative that the graphics rendering is smooth and lag-free. HyperRAM devices are AECQ-100 qualified and provides the ideal solution for fast bootup times, with low-pin-count interfaces for reduced design complexity and smaller PCB size.

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Industrial Machine vision

Industrial Cameras and thermal imaging cameras are used in a wide range of applications, from the manufacturing and processing of industrial products to security and surveillance. The FPGAs within the camera filters and processes the signals generated by its sensors and detectors. Often the RAM blocks within the FPGA is insufficient for storing and processing the data. Rather than having to implement a costly DDR DRAM memory controller, a gate-count efficient HyperBus Memory Controller can be implemented in soft IP in the FPGA, making this an optimal and efficient approach to off-chip expansion memory.

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Consumer and Industrial HMI

A human-machine interface (HMI) is a user interface or dashboard that enables a person to connect with a machine, system, or device. With the advent of the Internet of things (IoT), there has been a tremendous boom in HMI-enabled such as smart thermostats, surveillance cameras, and smart home appliances. In both industrial HMI and HMI for consumer electronics, there is a strong push to shrink PCB size by using small-footprint, low-pin-count semiconductor components. Additionally, since HMI-enabled consumer electronics are typically battery-powered, there is a need for all components to help maximize system battery life. HyperRAM’s small package size, high throughput and multiple low power modes make it well-suited for space-constrained HMI systems in industrial, consumer, and IoT applications.

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