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CYW20721 | Cypress Semiconductor

CYW20721

CYW20721 Datasheet
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CYW20721 Features

The CYW20721 is a Bluetooth® 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth LE, EDR and BR. The device is intended for use in audio, IoT, sensors (medical, home, security, and so forth) and human interface device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, the CYW20721 employs high level of integration to reduce external components, thereby minimizing application footprint and costs.

 

Microcontroller

  • 96-MHz Arm® Cortex®-M4 microcontroller unit MCU with floating point unit (FPU)

  • Supports serial wire debug (SWD)

  • Runs Bluetooth® stack and application

  • Option to execute from on-chip flash or RAM

Bluetooth Sub-System

  • Complies with Bluetooth Core Specification v5.1 with Bluetooth LE 2 Mbps

  • Supports Basic Rate (BR), Enhanced Data Rate (EDR) 2&3 Mbps, Bluetooth Low Energy

  • Supports Adaptive Frequency Hopping (AFH)

  • TX power 6 dBm

  • RX sensitivity -95.5 dBm (Bluetooth LE)

Peripherals

  • 6x 16-bit PWMs

  • Programmable key-scan matrix interface, up to 8x20 key-scanning matrix

  • Watchdog timer (WDT)

  • 1x peripheral UART, 1x UART for programming and HCI

  • 2x SPI (master or slave mode) Blocks (SPI, Quad SPI, and MIPI DBI-C)

  • 1x I2C master/slave and 1x I2C master

  • 1x 28-channel ADC (10-ENoB for DC measurement and 12- ENOB for Audio measurement

CYW20721 Block Diagram

CYW20721 Product Block Diagram

 

Getting Started with the CYW20721

Evaluate the CYW20721

 

CYW920721B2EVK-02 Evaluation Kit

The Cypress CYW920721B2EVK-02 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth applications using the CYW20721, an ultra-low-power dual-mode Bluetooth 5.1 wireless MCU device for Audio.

CYW20721 is a stand-alone baseband processor with an integrated 2.4 GHz transceiver supporting BR/EDR/BLE. Manufactured using advanced CMOS low-power process, the CYW20721 employs high integration to reduce external components, thereby minimizing the device's footprint and cost. This kit helps evaluate device functionality and develop applications quickly for faster time-to-market.

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CYW920721B2EVK-02 Evaluation Kit

 

 

ModusToolbox IDE and Bluetooth SDK

The Bluetooth SDK contains everything you need to build applications following dual-mode (BR + EDR + BLE). The Bluetooth SDK along with the ModusToolbox® IDE and Bluetooth configurator tools form a powerful but easy to use toolset that helps you create amazing Bluetooth-enabled IoT solutions such as beacons, trackers, smart watches, audio devices (headsets and speaker), HID device (remotes, mice, and keyboards) medical devices, and home automation platforms.

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Document Type Title English
Datasheet CYW20721 Enhanced Low Power, BR/EDR/BLE Bluetooth 5.0 SOC for Audio Datasheet
Software ModusToolbox™ WICED Manufacturing Bluetooth Test Tool
ModusToolbox WICED AMS Library
ModusToolbox WICED ANCS Library
ModusToolbox Application Buffer Pools
ModusToolbox WICED Firmware Upgrade Library
ModusToolbox Hardware Debugging for CYW207xx and CYW208xx
ModusToolbox WICED HCI UART Control Protocol
ModusToolbox WICED HID Device Library
ModusToolbox MeshClient and ClientControlMesh App User Guide
ModusToolbox Secure Over-the-Air Firmware Upgrade
Community CYW20721B2 Product Guide

ModusToolbox IDE and Bluetooth SDK

The Bluetooth SDK contains everything you need to build applications following dual-mode (BR + EDR + BLE). The Bluetooth SDK along with the ModusToolbox® IDE and Bluetooth configurator tools form a powerful but easy to use toolset that helps you create amazing Bluetooth-enabled IoT solutions such as beacons, trackers, smart watches, audio devices (headsets and speaker), HID device (remotes, mice, and keyboards) medical devices, and home automation platforms. For more information: Bluetooth SDK.

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Cypress Development Kits

CYW920721B2EVK-02

CYW920721B2EVK-02

Development Kits

  • CYW20721 dual mode (BLE/BR/EDR) Bluetooth 5.0-compliant wireless MCU for Audio packaged into a SiP module with external Low noise amplifier and Power amplifier
  • Audio Arduino shield with on-board microphones, audio codec chip, headphone and speaker output
  • On-board sensors - a 9-axis motion sensor (3D digital linear acceleration sensor, 3D digital angular rate sensor, and 3D digital magnetic sensor) and a thermistor

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