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AIROC™ Bluetooth Low Energy Mesh | Cypress Semiconductor

AIROC™ Bluetooth Low Energy Mesh

The AIROC™ Bluetooth mesh solution including all mesh node types, sample application code for quick firmware development, helper applications including source code for Android, iOS and Windows and, certified Bluetooth modules that help you take your Smart Home products to market quickly and cost effectively!

Bluetooth mesh is a low-power, wireless network that enables many-to-many (m:m) device communication for large-scale device networks. Bluetooth mesh also increases the range achievable by Bluetooth devices by hopping messages from one device to another until it reaches its destination. Applications range from building automation in an industrial environment, to consumer applications, such as home automation.

AIROC™ Mesh solution supports:

  • Mesh profile v1.0
  • Mesh model v1.0
  • Mesh device properties v1.0
  • Mesh provisioning
  • Mesh core layers
  • Bluetooth 5.0 qualified
  • All node types: Relay, proxy, friend, low power node (LPN)

Bluetooth communication is supported natively on iOS, Android, and Windows devices, which allows your smartphone to directly manage your mesh network, removing the need for external hub solutions. The AIROC™ Bluetooth Mesh solution is the first SIG-compliant Bluetooth Mesh solution shipping in production. Infineon provides Helper applications and source code for iOS, Android and Windows platforms.

Infineon’s dual-mode Bluetooth (BR/EDR/Bluetooth Low Energy) devices support Bluetooth Low Energy SIG certified mesh. Infineon makes it easy to design Bluetooth Low Energy mesh-enabled applications quickly with an easy-to-use SDK. Infineon’s Bluetooth SDK with mesh support is integrated into ModusToolbox software suite. SDK includes demo code for key use cases such as dimmable light, dimmer and sensor. Many more code example and snip code examples are provided through GitHub. These code examples and snips showcase all mesh node types and models described in Bluetooth Low Energy mesh specification v1.0. These readily available examples greatly reduce develop time for end-applications.

The AIROC™ Bluetooth Low Energy mesh solution is industry's first in-production solution that makes it field-tested and guarantees to keep interoperability testing costs to minimum.

  1. Download and install ModusToolbox.
  2. Purchase CYW920719B2Q40EVB-01 kit to evaluate Bluetooth mesh using an AIROC™ CYW20719 Bluetooth and Bluetooth LE system on chip.
  3. Download kit documentation from CYW920719B2Q40EVB-01 eval kit webpage.
  4. Join the Developer Community and explore the ModusToolbox Bluetooth SDK community page for resources and support. The Developer Community has wealth of information to help you develop products using the AIROC™ CYW20719, AIROC™ 20835, and other AIROC™ Bluetooth products for mesh. Community provides a consolidated list of key documentation available for the device. Community hosts active forums that are staffed by the Infineon engineers. In the forums you can find solution to the problems that you may be facing while developing your application. If an answer is not already available, you can post your question in the forum and an Infineon engineer will help you with the issue.

AIROC™ Bluetooth: Mesh-Qualified Products

Family CYW20706 CYW20835 CYW20719 CYW20721
Datasheet
Software Support
ModusToolbox
AIROC™ Bluetooth Modules

CYBT-343026-01

CYBT-353027-02

CYBLE-333074-02

CYBLE-343072-02

CYBT-413055-02

CYBT-423054-02

CYBT-483056-02

CYBT-413061-02

CYBT-423060-02

CYBT-483062-02

 
Bluetooth Mesh Features
Mesh Profile Supported
Mesh Profile 1.0, Mesh Model 1.0, Mesh Device Properties 1.0
Mesh Node Supported
Relay, Proxy, Low Power Node (LPN), Friend
Provisioning
Advertisement and GATT bearer, Remote provisioning over mesh (pre spec)
Over-The-Air (OTA) Upgrade
GATT based OTA, OTA over Mesh (pre spec)
Qualified Models
Battery, Default Transition time, level, CTL, HSL, LC, Lightness, XYL, Location, OnOff, Power level, Power OnOff, Property, Scene, Scheduler, Sensor, Time, Vendor, Specific
 
Silicon Features
Bluetooth Spec. Bluetooth 5.2 Bluetooth 5.2 Bluetooth 5.1 Bluetooth 5.1
RX Sensitivity -93.5 dBm -94.5 dBm -95.5 dBm -95.5 dBm
Max. TX Power +12 dBm (Programmable TX Power) +12 dBm (Programmable TX Power) +5 dBm (Programmable TX Power) +5 dBm (Programmable TX Power)
Power-Class Class 1, Class 2 Class 1, Class 2 Class 1, Class 2 Class 1, Class 2
CPU Core Arm Cortex M3 Arm Cortex M4 w/ FPU Arm Cortex M4 w/ FPU Arm Cortex M4 w/ FPU
Flash/EEPROM

Ext. Flash/EEPROM support

Internal 848 KB ROM

2 MB ROM 1 MB Flash, 2 MB ROM 1 MB Flash, 2 MB ROM
SRAM 352 KB 384 KB 512 KB 512 KB
Coexistence Interface GCI SECI (2-wire) GCI SECI (2-wire) GCI SECI (2-wire) GCI SECI (2-wire)
Serial Interfaces 2 UART, 2 SPI, I2C, PCM, I2S 2 UART, 2 SPI, I2C, PCM, I2S 2 UART, 2 SPI, I2C, PCM, I2S 2 UART, 2 SPI, I2C, PCM, I2S
ADC

10-bit @ 100 KHz (Static)

13-bit @ 16 KHz (Audio)

10-bit @ 100 KHz (Static)

13-bit @ 16 KHz (Audio)

10-bit @ 100 Kksps (Static) 10-bit @ 100 Kksps (Static)
GPIOs Up to 24 Up to 24 16 (QFN), 40 (WLCSP) 16 (QFN), 40 (WLCSP)
Other Features 4 PWMs 6 PWMs 6 PWMs 6 PWMs

CYW920835M2EVB-01 Evaluation Kit:

The Infineon CYW920835M2EVB-01 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth® Low Energy applications using the AIROC™ CYW20835, an ultra-low power Bluetooth® LE 5.2 system on a chip.

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CYW920835M2EVB-01 Evaluation Kit

 

CYW920721M2EVK-02 Evaluation Kit:

The Infineon CYW920721M2EVK-02 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth® applications using the AIROC™ CYW20721, an ultra-low power dual-mode Bluetooth® 5.1 system on a chip.

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CYW920721M2EVK-02 Evaluation Kit

 

CYW920719B2Q40EVB-01 Evaluation Kit:

The Infineon CYW920719B2Q40EVB-01 Evaluation Kit enables you to evaluate and develop single-chip Bluetooth® applications using the AIROC™ CYW20719, an ultra-low-power dual-mode Bluetooth® 5.1 system on a chip.

Price: $59.99

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CYW920719B2Q40EVB-01 Evaluation Kit

 

CYW920706WCDEVAL Evaluation Kit:

The Infineon CYW920706WCDEVAL Evaluation Kit enables you to evaluate and develop single-chip Bluetooth® applications using the AIROC™ CYW20706, a dual-mode Bluetooth® 5.2 system on a chip.

Price: $59.00

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CYW920706WCDEVAL Evaluation Kit

 

ModusToolbox Software and Tools

ModusToolbox™ was built to make the developers life easy. It is a collection of easy-to-use software and tools enabling rapid development of Infineon MCUs, covering applications from embedded sense and control to wireless and cloud-connected systems using AIROC™ Wi-Fi, AIROC™ Bluetooth® and AIROC™ Wi-Fi and Combo devices.

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Infineon Mesh Client Windows 10 App

The Mesh Client App provides a sample Windows 10 implementation that shows how to use interfaces exposed by the mesh libraries. The Mesh Client application uses PC’s in-built Bluetooth to communicate with Bluetooth mesh.

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Infineon Mesh Client Control Windows App

 

The Mesh Client Control applications provide a sample implementation that shows how to use interfaces exposed by the mesh libraries. The Mesh Client Control application requires an Infineon AIROC™ Bluetooth device to act as client and hence requires an extra evaluation board to be connected to PC for mesh evaluation. Any of the AIROC™ Bluetooth devices that support Bluetooth mesh can be used for this application irrespective of the device used by the mesh nodes.

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Infineon Mesh Client Android App

The Mesh Client Android App provides a sample Android-based implementation that shows how to use interfaces exposed by the mesh libraries. The Mesh Client application uses phone’s inbuilt Bluetooth and talks to proxy node over GATT.

Learn More/Download

 

Infineon Mesh Client Control iOS App

The Mesh Client Android App provides a sample iOS-based implementation that shows how to use interfaces exposed by the mesh libraries. The Mesh Client application uses phone’s inbuilt Bluetooth and talks to proxy node over GATT.

Learn More/Download

AIROC™ Bluetooth: Mesh-Qualified Modules
AIROC™ Bluetooth: Partner Modules