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PTN202703A |
Addendum to PTN202703 - July 2020 Product Obsolescence Notification |
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PCN211306 |
Qualification of Fab 25 as an Additional Wafer Fab Site and Marketing Part Number Change for Select Automotive MCU Products |
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PCN211301 |
Qualification of XMC as an Additional Wafer Fab Site for Automotive FL512S NOR Flash Memory Products |
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PTN211303 |
January 2021 Product Obsolescence Notification for Memory Solution Products |
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PCN211305 |
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package Memory Products |
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PCN211302 |
Qualification of Cypress Thailand as an Additional Assembly Site and PTI-TW as a New Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) Package |
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PCN211203 |
Qualification of Tera Probe Inc. as a Replacement Wafer Sort Site for 200mm Select Analog and Automotive MCU Products |
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PCN210502 |
Qualification of PTI-TW as an Additional Wafer Bump Site for Select UMC Plated Bump Flip Chip FBGA (FCFBGA) IOT Products |
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PCN211205 |
Assembly Site and Bill of Materials Information for Select Industrial-Grade 32Mb MoBL® SRAM Product |
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PCN211204 |
Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products |
