SL811HST-AXC | Cypress Semiconductor
SL811HST-AXC
| Development Kit | N/A |
| Application | USB Embedded Hosts |
| Automotive Qualified | N |
| CPU Core | CY16 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| Host Ports | 0 |
| I/O Options | N/A |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.45 |
| Memory Architecture | ROM/RAM |
| Memory Size (KB) | 256 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Endpoints | 4 |
| No. of I/Os | 8 |
| Software Tools | N/A |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $18.14 | $15.66 | $14.84 | $12.37 | $12.00 | $11.18 |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
275 L x 1.4 H x 275 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1250
Minimum Order Quantity (MOQ)
1250
Order Increment
1250
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Marking
Technical Documents
Application Notes (2)
Development Kits/Boards (1)
Product Change Notice (PCN) (3)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan