S29GL512S11TFB020 | Cypress Semiconductor
S29GL512S11TFB020
| Automotive Qualified | Y |
| Density (Mbit) | 512 |
| Initial Access Time (ns) | 110 |
| Interface Frequency (SDR / DDR) (MHz) | NA |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Voltage (V) | 2.70 |
| Operating Voltage (V) | 3 |
| Page Access Time (ns) | 15 |
| Part Family | Parallel NOR |
| Series | GL-S |
| Tape & Reel | N |
| Temperature Range (Min C to Max C) | -40C to +105C |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $12.76 | $10.73 | $9.57 | $8.41 | $7.95 | $7.42 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
56
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
910
Minimum Order Quantity (MOQ)
91
Order Increment
91
Estimated Lead Time (days)
49
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Matte Tin Plating
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: May 16, 2017
Technical Documents
Application Notes (25)
Jun 03, 2020
May 31, 2020
Product Change Notice (PCN) (2)
Apr 14, 2020
Qualification of XMC as an Additional Wafer Fab Site for Automotive GL-S NOR Flash Memory Products
Apr 07, 2020
Qualification of Tera Probe, Inc. Japan as an Additional Wafer Sort Site for Flash NOR GL01GS and GL512S Product
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (1)
Apr 14, 2020
Qualification of WXIC, China as an Additional Wafer Foundry Site for 65nm GL-S MirrorBit® Eclipse Flash Memory Products