S29GL512P10TFIR10 | Cypress Semiconductor
S29GL512P10TFIR10
Automotive Qualified | N |
Density (Mbit) | 512 |
Initial Access Time (ns) | 100 |
Interface | Parallel |
Interface Frequency (SDR / DDR) (MHz) | NA |
Max. Operating Temp. (°C) | 85 |
Max. Operating Voltage (V) | 3.60 |
Min. Operating Temp. (°C) | -40 |
Min. Operating Voltage (V) | 2.70 |
Operating Voltage (V) | 3 |
Page Access Time (ns) | 25 |
Part Family | Parallel NOR |
Series | GL-P |
Tape & Reel | N |
Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$9.11 | $7.66 | $6.83 | $6.00 | $5.67 | $5.30 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
56
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
91
Order Increment
91
Estimated Lead Time (days)
182
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Matte Tin Plating
Marking
Technical Documents
Application Notes (25)
Mar 03, 2021
Mar 02, 2021
Product Change Notice (PCN) (1)
Feb 15, 2018
Qualification of an Alternate Mold Compound and Die Attach Epoxy for TSOP Packages