S29GL256S10TFA023 | Cypress Semiconductor
S29GL256S10TFA023
| Automotive Qualified | Y |
| Density (Mbit) | 256 |
| Initial Access Time (ns) | 100 |
| Interface | Parallel |
| Interface Frequency (SDR / DDR) (MHz) | NA |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.70 |
| Operating Voltage (V) | 3 |
| Page Access Time (ns) | 15 |
| Part Family | Parallel NOR |
| Series | GL-S |
| Tape & Reel | Y |
| Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.99 | $6.72 | $5.99 | $5.26 | $4.97 | $4.65 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
56
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
49
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Matte Tin Plating
Marking
Technical Documents
Application Notes (25)
Jun 03, 2020
May 31, 2020
Product Change Notice (PCN) (1)
Apr 14, 2020
Qualification of XMC as an Additional Wafer Fab Site for Automotive GL-S NOR Flash Memory Products
Advanced Product Change Notice (APCN) (9)
Apr 23, 2020
Addendum to APCN181801 - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family
Apr 14, 2020
Addendum to Advance PCN181801A - Planned Qualification of Tera Probe, Inc. Japan as an Additional Wafer Test (Sort) Site for GL-S Product Family
Product Information Notice (PIN) (1)
Apr 14, 2020
Qualification of WXIC, China as an Additional Wafer Foundry Site for 65nm GL-S MirrorBit® Eclipse Flash Memory Products