S29GL032N11TFIV20 | Cypress Semiconductor
S29GL032N11TFIV20
Automotive Qualified | N |
Density (Mbit) | 32 |
Initial Access Time (ns) | 110 |
Interface | Parallel |
Interface Frequency (SDR / DDR) (MHz) | NA |
Max. Operating Temp. (°C) | 85 |
Max. Operating Voltage (V) | 3.60 |
Min. Operating Temp. (°C) | -40 |
Min. Operating Voltage (V) | 2.70 |
Operating Voltage (V) | 3 |
Page Access Time (ns) | 25 |
Part Family | Parallel NOR |
Series | GL-N |
Tape & Reel | N |
Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$3.52 | $2.96 | $2.64 | $2.32 | $2.19 | $2.05 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
56
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
910
Minimum Order Quantity (MOQ)
91
Order Increment
91
Estimated Lead Time (days)
91
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Matte Tin Plating
Marking
Technical Documents
Application Notes (25)
Jun 03, 2020
May 31, 2020
Product Change Notice (PCN) (1)
Feb 15, 2018
Qualification of an Alternate Mold Compound and Die Attach Epoxy for TSOP Packages