S29AL016J70TFI010 | Cypress Semiconductor
S29AL016J70TFI010
| Automotive Qualified | N |
| Density (Mbit) | 16 |
| Initial Access Time (ns) | 70 |
| Interface | Parallel |
| Interface Frequency (SDR / DDR) (MHz) | NA |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.70 |
| Operating Voltage (V) | 3 |
| Part Family | Parallel NOR |
| Series | AL-J |
| Tape & Reel | N |
| Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.11 | $1.78 | $1.58 | $1.39 | $1.32 | $1.23 |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
364
HTS Code
8542.32.0051
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Matte Tin Plating
Marking
Technical Documents
Application Notes (8)
Product Change Notice (PCN) (1)
Feb 15, 2018
Qualification of an Alternate Mold Compound and Die Attach Epoxy for TSOP Packages