FM24VN10-G | Cypress Semiconductor

FM24VN10-G
Status: In Production

Datasheet

(pdf, 681.21 KB) RoHS PB Free

FM24VN10-G

Development KitNo
Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)3.4
InterfaceI2C
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.00
Min. Operating Voltage (V)2.00
Organization (X x Y)128Kb x 8
Part FamilySerial FRAM
Speed (ns)0
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.10 $10.83 $9.75 $8.60 $8.34 $8.03
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
8
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
194
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
56
HTS Code
8542.32.0071
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (2)

Apr 14, 2020
Qualification of Texas Instruments' DMOS6 as an Additional Wafer Fab Site, Cypress's Test 25 as an Additional Wafer Sort Site, OSE-Taiwan as an Additional Assembly Site for 32TSOP Package with Copper-Palladium-Gold Wire for Select 1Mb Parallel and Copper-Palladium Wire at UTAC-Thailand for Select 512Kb/1Mb Serial Industrial-Grade Products
Oct 25, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for F-RAM Products

Advanced Product Change Notice (APCN) (4)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update

Product Information Notice (PIN) (7)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of an Additional Top Passivation Layer for F-RAM Devices
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
F-RAM PRODUCTS DATASHEET FORMAT CHANGES
Nov 06, 2017
Changes to F-RAM Minimum Order Quantities, Order Increments, and Factory Order Increments to Align with Cypress Standards
Nov 06, 2017
Changes to F-RAM Marking to Align with Cypress Standards

Verilog (1)

Mar 22, 2017

IBIS (1)

Jul 03, 2014