FM24CL64B-DGTR | Cypress Semiconductor

FM24CL64B-DGTR
Status: In Production

Datasheet

(pdf, 488.22 KB) RoHS PB Free

FM24CL64B-DGTR

Development KitN
Automotive QualifiedN
Density (Kb)64
Frequency (MHz)1
InterfaceI2C
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)8Kb x 8
Part FamilySerial FRAM
Speed (ns)0
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.09 $3.66 $3.29 $2.90 $2.82 $2.71
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
8
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
3000
Minimum Order Quantity (MOQ)
3000
Order Increment
3000
Estimated Lead Time (days)
147
HTS Code
8542.32.0071
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Product Change Notice (PCN) (4)

Oct 05, 2020
Addendum to PCN201502*A - Qualification of Fab 25 as an Alternate Wafer Fab Site and a Bond Wire Change for Industrial-Grade 4Kb, 16Kb and 64Kb F-RAM Products
Apr 26, 2020
Addendum to PCN201502 - Qualification of Fab 25 as an Alternate Wafer Fab Site and a Bond Wire Change for Industrial-Grade 4Kb, 16Kb and 64Kb F-RAM Products
Apr 14, 2020
Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Cypress’ Test 25 as an Additional Wafer Sort Site and Copper Palladium Wires for Select 64Kb/16Kb/4Kb F-RAM Serial Industrial-grade Products.
Oct 25, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for F-RAM Products

Advanced Product Change Notice (APCN) (5)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (7)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Qualification of Cypress Minnesota as Wafer Sort facility for F-RAM Products
Nov 06, 2017
Qualification of a Top Passivation Layer on F-RAM Devices
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
F-RAM PRODUCTS DATASHEET FORMAT CHANGES
Nov 06, 2017
Changes to F-RAM Marking to Align with Cypress Standards

Verilog (1)

Mar 22, 2017

IBIS (1)

Jul 03, 2014