FM22L16-55-TG | Cypress Semiconductor

FM22L16-55-TG
Status: In Production

Datasheet

(pdf, 478.99 KB) RoHS PB Free

FM22L16-55-TG

Development KitNo
Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)256Kb x 16
Part FamilyParallel FRAM
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$40.85 $36.55 $32.90 $29.03 $28.17 $27.09
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

No. of Pins
44
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
135
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
182
HTS Code
8542.32.0071
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (3)

Apr 14, 2020
Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Test 25 as an Additional Wafer Sort Site, OSE-Taiwan as an Additional Assembly Site for 44-TSOP II Package with Copper Wire for the 4Mb Parallel Industrial-Grade Product Family
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
Oct 11, 2017
Qualification of JCET as an Alternate Assembly Site and CML as an Alternate Test, Finish & Burn-In Site for Select 44-Lead TSOP II Package Products

Advanced Product Change Notice (APCN) (3)

Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (6)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of an Additional Top Passivation Layer for F-RAM Devices
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
F-RAM PRODUCTS DATASHEET FORMAT CHANGES
Nov 06, 2017
Changes to F-RAM Marking to Align with Cypress Standards

Verilog (1)

Apr 03, 2014