CYW20736A1KWBGT | Cypress Semiconductor

CYW20736A1KWBGT
Status: In Production

Datasheet

(pdf, 1.23 MB) RoHS PB Free

CYW20736A1KWBGT

Automotive GradeN
Automotive QualifiedN
Bluetooth SpecificationBluetooth 4.1
CPU CoreARM Cortex M3
Dedicated ADC (Max. Resolution @ Sampling Rate)10-bit @ 187 KHz (Static) 13-bit @ 5.8 KHz (Audio)
Device TypeSilicon
Interfaces2 UART, 2 SPI, I2C
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-30
Min. Operating Voltage (V)1.40
No. of GPIOs40
Partner Modules AvailableY
Power-ClassClass 2, Class 3
Product FamilyBCM20736
RAM (KB)60
Silicon FeaturesInfrared TX/RX, Wireless Charging (A4WP), LE Audio
Software SupportWICED
Tape & ReelY
Wireless TechnologyBluetooth Low Energy

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.09 $2.67 $2.53 $2.11 $2.04 $1.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
80
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
5000
Minimum Order Quantity (MOQ)
5000
Order Increment
5000
Estimated Lead Time (days)
168
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag

Technical Documents

Application Notes (25)

Product Change Notice (PCN) (1)

Apr 14, 2020
Qualification of PTI-SG as an Additional Bumping, Backend and Finish Site for Select Plated Bump 40nm WLCSP Products

Advanced Product Change Notice (APCN) (3)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Marking Change for Select Standard IoT WLCSP Packages
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Wireless Products Failure Analysis Policy Change