CYW20706UA2KFFB4GT | Cypress Semiconductor

CYW20706UA2KFFB4GT
Status: In Production

Datasheet

(pdf, 727.64 KB) RoHS PB Free

CYW20706UA2KFFB4GT

Automotive GradeN
Automotive QualifiedN
Bluetooth SpecificationBluetooth 5.0
CPU CoreARM Cortex M3
Co-existence InterfaceGCI SECI
Cypress Module Area (mm)N/A
Dedicated ADC (Max. Resolution @ Sampling Rate)10-bit @ 100 KHz (Static) 13-bit @ 16 KHz (Audio)
Device TypeSilicon
Interfaces2 UART, 2 SPI, I2C, PCM, I2S
Max. Operating Frequency (MHz)96
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-30
Min. Operating Voltage (V)3.00
Module FeaturesN/A
No. of GPIOs24
Partner Modules AvailableY
Power-ClassClass 1, Class 2
Product FamilyBCM20706
RAM (KB)352
Silicon FeaturesInfrared TX
Software SupportWICED
Tape & ReelY
Wireless TechnologyBluetooth (BR + EDR + BLE)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Contact Sales
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
49
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
5A992.C

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu;Sn/Ag;Sn/Ag/Cu/Ni

Technical Documents

Application Notes (25)

Product Change Notice (PCN) (2)

May 06, 2020
Qualification of PTI Singapore (PTI-SG) as an Additional Bumping Site for Select Plated Bump WLCSP Products
Apr 14, 2020
Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) IoT Products

Advanced Product Change Notice (APCN) (3)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
CVE-2018-19860 - Vulnerability in Certain Cypress Bluetooth Controllers Containing Certain Firmware Versions
Apr 14, 2020
Wireless Products Failure Analysis Policy Change