CYV15G0204TRB-BGXC | Cypress Semiconductor

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CYV15G0204TRB-BGXC
Status: In Production

Datasheet

(pdf, 920.57 KB) RoHS PB Free

CYV15G0204TRB-BGXC

8B / 10B ENDECN
Automotive QualifiedN
FunctionsSERDES
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Max. Speed (Mbps)1500
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
Min. Speed (Mbps)143
No. of Channels2
StandardSMPTE / DVBASI
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Contact Sales
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
256
Package Dimensions
1 063 L x 1.6 H x 1 063 W (Mils)
Package Weight
4 186.49 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
400
Minimum Order Quantity (MOQ)
40
Order Increment
40
Estimated Lead Time (days)
182
HTS Code
8542.39.0001
ECCN
B.1
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (21)

Development Kits/Boards (2)

Apr 23, 2012
Apr 07, 2010

Software and Drivers (1)

Product Change Notice (PCN) (2)

May 27, 2018
Shipping Label Upgrade
Oct 24, 2017
Qualification of an alternate die attach epoxy at ASE Taiwan for select 256 Ball Grid Array (BGA) packaged products

Product Information Notice (PIN) (4)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

IBIS (1)

Apr 07, 2010

BSDL (2)

Apr 07, 2010
Apr 07, 2010