CYV15G0101DXB-BBXC | Cypress Semiconductor

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CYV15G0101DXB-BBXC
Status: In Production

Datasheet

(pdf, 1003.01 KB) RoHS PB Free

CYV15G0101DXB-BBXC

8B / 10B ENDECY
Automotive QualifiedN
FunctionsSERDES
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Max. Speed (Mbps)1500
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
Min. Speed (Mbps)143
No. of Channels1
StandardSMPTE / DVBASI
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$61.83 $59.24 $56.64 $54.05 $51.45 $47.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1760
Minimum Order Quantity (MOQ)
176
Order Increment
176
Estimated Lead Time (days)
182
HTS Code
8542.39.0001
ECCN
B.1
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (21)

Development Kits/Boards (2)

Feb 08, 2012
Feb 08, 2012

Software and Drivers (1)

Product Change Notice (PCN) (2)

May 28, 2018
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls

IBIS (1)

Apr 07, 2010