CYUSB3014-BZXI | Cypress Semiconductor
CYUSB3014-BZXI
| Development Kit | CYUSB3KIT-001 |
| Application | USB SuperSpeed Peripherals |
| Automotive Qualified | N |
| CPU Core | ARM926 EJ-S |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 1.25 |
| Memory Architecture | SRAM |
| Memory Size (KB) | 512 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.15 |
| No. of Endpoints | 32 |
| No. of I/Os | 60 |
| Software Tools | EZ-USB FX3 SDK and GPIF II Designer |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $35.46 | $28.83 | $27.46 | $26.31 | $25.85 | $24.02 |
Packaging/Ordering
No. of Pins
121
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
168
Minimum Order Quantity (MOQ)
168
Order Increment
168
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 21, 2016
Technical Documents
Technical Reference Manuals (1)
Application Notes (12)
Dec 08, 2019
Product Change Notice (PCN) (8)
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 121 Ball Grid Array (BGA) packaged products