CYUSB2014-BZXCT | Cypress Semiconductor
CYUSB2014-BZXCT
| Development Kit | CYUSB3KIT-001 |
| Application | USB HighSpeed Peripherals |
| Automotive Qualified | N |
| CPU Core | ARM926 EJ-S |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 1.25 |
| Memory Architecture | SRAM |
| Memory Size (KB) | 512 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 1.15 |
| No. of Endpoints | 32 |
| No. of I/Os | 60 |
| Software Tools | EZ-USB FX3 SDK and GPIF II Designer |
| Tape & Reel | Y |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $17.82 | $15.39 | $14.58 | $12.15 | $11.79 | $10.98 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
121
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 21, 2016
Technical Documents
Application Notes (12)
May 28, 2020
Product Change Notice (PCN) (3)
May 07, 2020
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Product Information Notice (PIN) (2)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization