CYUSB2014-BZXC | Cypress Semiconductor

CYUSB2014-BZXC
Status: In Production

Datasheet

(pdf, 1.37 MB) RoHS PB Free
(pdf, 1.15 MB) RoHS PB Free
(pdf, 1.1 MB) RoHS PB Free

CYUSB2014-BZXC

Development KitCYUSB3KIT-001
ApplicationUSB HighSpeed Peripherals
Automotive QualifiedN
CPU CoreARM926 EJ-S
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)1.25
Memory ArchitectureSRAM
Memory Size (KB)512
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.15
No. of Endpoints32
No. of I/Os60
Software ToolsEZ-USB FX3 SDK and GPIF II Designer
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.82 $15.39 $14.58 $12.15 $11.79 $10.98
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
121
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1680
Minimum Order Quantity (MOQ)
168
Order Increment
168
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
N/A

Technical Documents

Application Notes (12)

Product Change Notice (PCN) (3)

May 07, 2020
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (3)

Jul 28, 2020
USB Products Failure Analysis Policy Change
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization