CYP15G0401DXB-BGXC | Cypress Semiconductor
CYP15G0401DXB-BGXC
| 8B / 10B ENDEC | Y |
| Automotive Qualified | N |
| Functions | Transceiver |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.45 |
| Max. Speed (Mbps) | 1500 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.15 |
| Min. Speed (Mbps) | 200 |
| No. of Channels | 4 |
| Standard | Fibre Channel / ESCON / GE / DVBASI |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| Contact Sales | |||||
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
256
Package Dimensions
1 063 L x 1.6 H x 1 063 W (Mils)
Package Weight
4 186.49 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
400
Minimum Order Quantity (MOQ)
40
Order Increment
40
Estimated Lead Time (days)
182
HTS Code
8542.39.0001
ECCN
B.1
ECCN Suball
5A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Technical Documents
Application Notes (22)
Jul 18, 2017
Jul 14, 2017
Development Kits/Boards (2)
Software and Drivers (2)
Product Change Notice (PCN) (2)
Oct 24, 2017
Qualification of an alternate die attach epoxy at ASE Taiwan for select 256 Ball Grid Array (BGA) packaged products
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization