CY9BF515NBGL-GE1 | Cypress Semiconductor

CY9BF515NBGL-GE1

Automotive QualifiedN
Part FamilyFM3
Part FamilyFM3
Tape & ReelN

Pricing & Inventory Availability

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Packaging/Ordering

No. of Pins
112
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
198
Order Increment
198
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish

Technical Documents

Application Notes (17)

Product Change Notice (PCN) (2)

May 28, 2020
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
Mar 29, 2020
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products

Advanced Product Change Notice (APCN) (7)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

Apr 14, 2020
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
Mar 25, 2020
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)