CY9AFB44MBBGL-GE1 | Cypress Semiconductor
CY9AFB44MBBGL-GE1
| Automotive Qualified | N |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.63 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 1.10 |
| Part Family | FM3 |
| Part Family | FM3 |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.65 | $10.49 | $9.55 | $8.62 | $7.92 | $6.29 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
96
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
4
Peak Reflow Temp. (°C)
250 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn-3Ag-0.5Cu
Marking
Technical Documents
Application Notes (15)
Product Change Notice (PCN) (2)
May 28, 2020
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
Mar 29, 2020
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
Advanced Product Change Notice (APCN) (7)
Apr 14, 2020
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
Apr 14, 2020
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products