CY8C9540A-24PVXI | Cypress Semiconductor

CY8C9540A-24PVXI
Status: In Production

Datasheet

(pdf, 452.81 KB) RoHS PB Free
(pdf, 869.21 KB) RoHS PB Free

CY8C9540A-24PVXI

Development KitCY3242-IOX, CY3242-IOXLite
Automotive QualifiedN
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)11
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
No. of GPIOs40
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks0
SRAM (KB)0
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.85 $4.64 $4.44 $4.24 $4.03 $3.70
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
SOP
No. of Pins
48
Package Dimensions
625 L x 2.3 H x 295 W (Mils)
Package Weight
650.23 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
150
Minimum Order Quantity (MOQ)
150
Order Increment
150
Estimated Lead Time (days)
105
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Package Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Aug 29, 2018

Product Change Notice (PCN) (16)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 27, 2018
This is a correction to the Method of Identification section in the just released PCN#071421. Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
May 27, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
May 27, 2018
Qualification of Grace Semiconductor as an Additional Wafer Foundry Site for
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

Aug 23, 2020
Q32020 Horizon Report Update

Product Information Notice (PIN) (6)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

IBIS (1)

Mar 16, 2012