CY8C6347BZI-BLD43 | Cypress Semiconductor
CY8C6347BZI-BLD43
| Automotive Qualified | N |
| BLE Maximum Data Rate (Mbps) | 2 |
| BLE Power Output (dBm) | 4 |
| BLE RX Sensitivity (dBm) | -95 |
| BLE Supported Frequency band (GHz) | 2.4 |
| CapSense | Y |
| Cryptographics Accelerator | (AES, 3DES, RSA, SHA-512, SHA-256 and ECC) |
| Dedicated ADC (#_ Max Resolution @ Sample Rate) | SAR (1, 12-bit @ 1 msps) |
| Dedicated DAC (#_ Max Resolution @ Sample Rate) | (1,12-bit @ 200 ksps) |
| FS-USB | None |
| Flash (KB) | 1024 |
| I2S | 1 |
| LCD Direct Drive | Y |
| Main Core | ARM Cortex-M4 |
| Max. Operating Frequency (MHz) | 150 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.70 |
| No. of CAN Controllers | 0 |
| No. of DMA Channels | 32 |
| No. of Dedicated Comparators | 2 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated Timer/Counter/PWM Blocks | 32 |
| No. of GPIOs | 78 |
| No. of Programmable Universal Digital Blocks | 0 |
| No. of Serial Communication Blocks (I2C, UART, SPI) | 9 |
| PDM-PCM | 2 |
| Quad-SPI | Y |
| SRAM (KB) | 288 |
| Secondary Core | ARM Cortex-M0 |
| Smart I/O | 16 |
| Tape & Reel | N |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.90 | $10.28 | $9.74 | $8.11 | $7.87 | $7.33 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| In Stock | 120 | 24-48 hours | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
116
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
364
Minimum Order Quantity (MOQ)
364
Order Increment
364
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN Suball
5A992.C
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Apr 24, 2019
Technical Documents
Application Notes (13)
Nov 03, 2019