CY8C5868LTI-LP038 | Cypress Semiconductor

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CY8C5868LTI-LP038
Status: In Production

Datasheet

(pdf, 7.45 MB) PB Free
(pdf, 4.58 MB) PB Free
(pdf, 8.06 MB) PB Free

CY8C5868LTI-LP038

Development KitCY8CKIT-050
Automotive QualifiedN
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 20-bit @ 180 sps), SAR (2, 12-bit @ 1000 ksps)
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
Part FamilyPSoC 5LP
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.38 $11.86 $11.34 $10.83 $10.31 $9.44
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
68
Package Dimensions
315 L x 35 H x 315 W (Mils)
Package Weight
177.81 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (8)

Product Change Notice (PCN) (3)

May 06, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family
Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
Oct 25, 2017
Qualification of Manufacturing Changes for PSoC 5LP Products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (5)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Boundary Scan BSDL (4)