CY8C5266FNI-LP205T | Cypress Semiconductor
CY8C5266FNI-LP205T
| Development Kit | CY8CKIT-050 |
| Automotive Qualified | N |
| Boost Converter (Volts) | 0.5 |
| CPU Core | ARM Cortex-M3 |
| CapSense | Y |
| Dedicated ADC (#_ Max Resolution @ Sample Rate) | SAR (1, 12-bit @ 1000 ksps) |
| Dedicated DAC (#_ Max Resolution @ Sample Rate) | (1, 8-bit @ 8 msps) |
| EEPROM (KB) | 2 |
| Flash (KB) | 256 |
| LCD Direct Drive (Yes/No) | Y |
| Max. Operating Frequency (MHz) | 80 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.71 |
| No. of CAN Controllers | 0 |
| No. of DMA Channels | 24 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated Digital Filter Blocks | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated Timer/Counter/PWM Blocks | 4 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 62 |
| No. of Programmable Analog Blocks | 0 |
| No. of Programmable Universal Digital Blocks | 24 |
| No. of SIO | 8 |
| No. of USB IO | 2 |
| Part Family | PSoC 5LP |
| SRAM (KB) | 64 |
| Series | PSoC 5200 |
| Tape & Reel | Y |
| USB (Type) | Full-Speed |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $6.06 | $5.81 | $5.55 | $5.30 | $5.05 | $4.62 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
99
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Technical Documents
Application Notes (8)
Jul 01, 2020
Product Change Notice (PCN) (2)
Jul 27, 2020
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Finish Process Site for Select WLCSP Products
May 06, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family
Advanced Product Change Notice (APCN) (5)
Product Information Notice (PIN) (3)
Aug 02, 2020
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization