CY8C5266FNI-LP205T | Cypress Semiconductor

CY8C5266FNI-LP205T
Status: In Production

Datasheet

(pdf, 4.84 MB) RoHS PB Free
(pdf, 3.79 MB) RoHS PB Free
(pdf, 5.21 MB) RoHS PB Free

CY8C5266FNI-LP205T

Development KitCY8CKIT-050
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU CoreARM Cortex-M3
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)SAR (1, 12-bit @ 1000 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(1, 8-bit @ 8 msps)
EEPROM (KB)2
Flash (KB)256
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)80
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers0
No. of DMA Channels24
No. of Dedicated Comparators0
No. of Dedicated Digital Filter Blocks0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs62
No. of Programmable Analog Blocks0
No. of Programmable Universal Digital Blocks24
No. of SIO8
No. of USB IO2
Part FamilyPSoC 5LP
SRAM (KB)64
SeriesPSoC 5200
Tape & ReelY
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.06 $5.81 $5.55 $5.30 $5.05 $4.62
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
99
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (8)

Product Change Notice (PCN) (2)

Jul 27, 2020
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Finish Process Site for Select WLCSP Products
May 06, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family

Advanced Product Change Notice (APCN) (5)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (3)

Aug 02, 2020
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization