CY8C4248FLI-BL583T | Cypress Semiconductor

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CY8C4248FLI-BL583T
Status: In Production

Datasheet

(pdf, 1.39 MB) RoHS PB Free

CY8C4248FLI-BL583T

Automotive QualifiedN
CPU CoreARM Cortex-M0
CapSenseY
Dedicated ADC (#Max Resolution @ Sample Rate)SAR (1, 12-bit @ 1 msps)
EEPROM (KB)0
Flash (KB)256
JTAG and Si ID0x1A1011AA
LCD Direct DriveY
Max. Operating Frequency (MHz)48
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.90
No. of CAN Controllers0
No. of Continuous Time Blocks2
No. of DMA Channels8
No. of Dedicated Comparators2
No. of Dedicated Timer/Counter/PWM Blocks4
No. of GPIOs36
No. of Op Amps4
No. of SIO0
No. of Serial Communication Blocks2
No. of USB IO0
No. of Universal Analog Blocks0
No. of Universal Digital Blocks4
PLLN
SRAM (KB)32
SeriesPSoC 4 BLE
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.23 $6.24 $5.91 $4.93 $4.78 $4.45
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
76
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
168
HTS Code
8542.31.0001
ECCN
B
ECCN Suball
5A992

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (11)

Product Change Notice (PCN) (2)

Jul 27, 2020
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Finish Process Site for Select WLCSP Products
Apr 14, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site, Test 25 as an Additional Sort Site and ASE-Kaohsiung Taiwan as an Additional Assembly, Test and Finish Site for the PSoC® 4xx7 BLE and PSoC® 4xx8 BLE Product Family

Product Information Notice (PIN) (3)

Aug 02, 2020
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization