CY8C4245FNI-483T | Cypress Semiconductor

CY8C4245FNI-483T
Status: In Production

Datasheet

(pdf, 1.45 MB) RoHS PB Free
(pdf, 1.93 MB) RoHS PB Free
(pdf, 1.15 MB) RoHS PB Free

CY8C4245FNI-483T

Automotive QualifiedN
CPU CoreARM Cortex-M0
CapSenseY
Dedicated ADC (#Max Resolution @ Sample Rate)SAR (1, 12-bit @ 1 msps)
EEPROM (KB)0
Flash (KB)32
JTAG and Si ID0x04E81193
LCD Direct DriveY
Max. Operating Frequency (MHz)48
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers0
No. of Continuous Time Blocks2
No. of DMA Channels0
No. of Dedicated Comparators2
No. of Dedicated Timer/Counter/PWM Blocks4
No. of GPIOs34
No. of Op Amps2
No. of SIO0
No. of Serial Communication Blocks2
No. of USB IO0
No. of Universal Analog Blocks0
No. of Universal Digital Blocks4
PLLN
SRAM (KB)4
SeriesPSoC 4200
SeriesPSoC 4200
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.63 $2.52 $2.41 $2.30 $2.19 $2.01
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
35
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (11)

Product Change Notice (PCN) (4)

Apr 14, 2020
Qualification of Fab 25 with the Copper (Cu) BEOL Process and Test 25 as an Additional Wafer Sort Site for the PSoC® 4200 Product Family
Apr 14, 2020
Qualification of Advantek Carrier Tape for 35-Ball WLCSP 3.23X2.10X0.55 mm (FN35A) Package
May 24, 2019
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Backend Process Site for Select WLCSP Products
Oct 12, 2017
Qualification of Cypress Fab 25 as an Additional Wafer Fab for MBR3 and PSoC 4000 Product Families

Advanced Product Change Notice (APCN) (5)

Aug 23, 2020
Q32020 Horizon Report Update
May 08, 2020
Qualification status of cypress 130nm sonos products at fab 25
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (4)

Aug 02, 2020
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 03, 2017
Update to PCN145319: PSoC Programmer Upgrade for PSoC 4A Products.