CY8C4245AZI-M443 | Cypress Semiconductor
CY8C4245AZI-M443
| Automotive Qualified | N |
| CPU Core | ARM Cortex-M0 |
| CapSense | Y |
| Dedicated ADC (#Max Resolution @ Sample Rate) | SAR (1, 12-bit @ 1 msps) |
| EEPROM (KB) | 0 |
| Flash (KB) | 32 |
| JTAG and Si ID | 0x1121 |
| LCD Direct Drive | Y |
| Max. Operating Frequency (MHz) | 48 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.71 |
| No. of CAN Controllers | 0 |
| No. of Continuous Time Blocks | 1 |
| No. of DMA Channels | 8 |
| No. of Dedicated Comparators | 2 |
| No. of Dedicated Timer/Counter/PWM Blocks | 8 |
| No. of GPIOs | 38 |
| No. of Op Amps | 2 |
| No. of SIO | 0 |
| No. of Serial Communication Blocks | 4 |
| No. of USB IO | 0 |
| No. of Universal Analog Blocks | 0 |
| No. of Universal Digital Blocks | 4 |
| PLL | N |
| SRAM (KB) | 4 |
| Series | PSoC 4200M |
| Series | PSoC 4200M |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.09 | $2.96 | $2.83 | $2.70 | $2.57 | $2.35 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| In Stock | 47 | 24-48 hours | Contact Sales | Buy |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
Technical Documents
Product Change Notice (PCN) (2)
Apr 14, 2020
Qualification of Greatek Electronic as an Additional Assembly, Test and Finish Sites for Select 48-Lead TQFP Pb-Free Products
Apr 14, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for the PSoC® 4200M Product Family
Advanced Product Change Notice (APCN) (7)
Product Information Notice (PIN) (2)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization