CY8C4128FNI-BL553T | Cypress Semiconductor
CY8C4128FNI-BL553T
Automotive Qualified | N |
CPU Core | ARM Cortex-M0 |
CapSense | Y |
Dedicated ADC (#Max Resolution @ Sample Rate) | SAR (1, 12-bit @ 806 ksps) |
EEPROM (KB) | 0 |
Flash (KB) | 256 |
JTAG and Si ID | 0x1A0111AA |
LCD Direct Drive | N |
Max. Operating Frequency (MHz) | 24 |
Max. Operating Temp. (°C) | 85 |
Max. Operating Voltage (V) | 5.50 |
Min. Operating Temp. (°C) | -40 |
Min. Operating Voltage (V) | 1.90 |
No. of CAN Controllers | 0 |
No. of Continuous Time Blocks | 1 |
No. of DMA Channels | 8 |
No. of Dedicated Comparators | 2 |
No. of Dedicated Timer/Counter/PWM Blocks | 4 |
No. of GPIOs | 36 |
No. of Op Amps | 2 |
No. of SIO | 0 |
No. of Serial Communication Blocks | 2 |
No. of USB IO | 0 |
No. of Universal Analog Blocks | 0 |
No. of Universal Digital Blocks | 0 |
PLL | N |
SRAM (KB) | 32 |
Series | PSoC 4 BLE |
Tape & Reel | Y |
USB (Type) | None |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$5.74 | $4.96 | $4.70 | $3.92 | $3.80 | $3.54 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
76
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN Suball
3A991.A.2
Quality and RoHS
Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Jan 18, 2017
Technical Documents
Application Notes (11)
Dec 08, 2020
Dec 08, 2020
Jun 02, 2020
Product Change Notice (PCN) (2)
Jul 27, 2020
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Finish Process Site for Select WLCSP Products
Apr 14, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site, Test 25 as an Additional Sort Site and ASE-Kaohsiung Taiwan as an Additional Assembly, Test and Finish Site for the PSoC® 4xx7 BLE and PSoC® 4xx8 BLE Product Family
Advanced Product Change Notice (APCN) (5)
Product Information Notice (PIN) (3)
Aug 02, 2020
Company Name Change From DECA Technologies Inc. to nepes hayyim Corporation Inc.
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization