CY8C3244LTI-130T | Cypress Semiconductor

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CY8C3244LTI-130T
Status: In Production

Datasheet

(pdf, 4.13 MB) RoHS PB Free
(pdf, 3.09 MB) RoHS PB Free

CY8C3244LTI-130T

Development KitCY8CKIT-001
Automotive QualifiedN
Boost Converter (Volts)0.5
CPU Core8051
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 12-bit @ 192 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(1, 8-bit @ 8 msps)
EEPROM (KB)0.5
Flash (KB)16
JTAG and Si ID0x1E082069
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)50
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers0
No. of DMA Channels24
No. of Dedicated Comparators2
No. of Dedicated Digital Filter Blocks0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs38
No. of Programmable Analog Blocks0
No. of Programmable Universal Digital Blocks16
No. of USB IO0
SRAM (KB)2
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.80 $3.64 $3.48 $3.33 $3.17 $2.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
68
Package Dimensions
315 L x 35 H x 315 W (Mils)
Package Weight
177.81 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (21)

Product Change Notice (PCN) (5)

Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (3)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (9)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 07, 2017
Marking Change for PSoC 3 68-Lead QFN Packages
Nov 07, 2017
PSoC Programmer Upgrade for PSoC 3 Family of Products
Nov 06, 2017
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families