CY8C29866-24AXI | Cypress Semiconductor
CY8C29866-24AXI
| Development Kit | CY3215-DK, CY3211-100TQFP |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | N |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | None |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 32 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 4 |
| No. of Dedicated UART | 4 |
| No. of GPIOs | 64 |
| No. of Programmable Analog Blocks | 12 |
| No. of Programmable Digital Blocks | 16 |
| SRAM (KB) | 2 |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.44 | $7.12 | $6.81 | $6.50 | $6.19 | $5.67 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
450
Minimum Order Quantity (MOQ)
450
Order Increment
450
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Nov 04, 2019
Last Update: Oct 30, 2019
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Application Notes (59)
Feb 19, 2018
Jan 29, 2018
Aug 26, 2015
Aug 26, 2015
Aug 18, 2015
Development Kits/Boards (8)
Jan 24, 2018
Software and Drivers (2)
Product Change Notice (PCN) (15)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
May 28, 2018
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (7)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).