CY8C29466-24SXI | Cypress Semiconductor
CY8C29466-24SXI
| Development Kit | CY3215-DK, CY3211-28SOIC |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | N |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | None |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 32 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 4 |
| No. of Dedicated UART | 4 |
| No. of GPIOs | 24 |
| No. of Programmable Analog Blocks | 12 |
| No. of Programmable Digital Blocks | 16 |
| SRAM (KB) | 2 |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $10.78 | $9.31 | $9.02 | $8.13 | $7.35 | $5.88 |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
705 L x 0 H x 300 W (Mils)
Package Weight
830.75 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
135
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Nov 08, 2016
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
Last Update: Oct 13, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Application Notes (59)
Feb 19, 2018
Jan 29, 2018
Aug 26, 2015
Aug 26, 2015
Aug 18, 2015
Development Kits/Boards (8)
Jan 24, 2018
Software and Drivers (2)
Product Change Notice (PCN) (18)
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
May 28, 2018
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
May 28, 2018
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (4)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products