CY8C29466-24PVXI | Cypress Semiconductor
CY8C29466-24PVXI
| Development Kit | CY3215-DK, CY3211-28SSOP |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | N |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | None |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 32 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 4 |
| No. of Dedicated UART | 4 |
| No. of GPIOs | 24 |
| No. of Programmable Analog Blocks | 12 |
| No. of Programmable Digital Blocks | 16 |
| SRAM (KB) | 2 |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $9.86 | $8.51 | $8.24 | $7.44 | $6.72 | $5.38 |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2350
Minimum Order Quantity (MOQ)
235
Order Increment
235
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: Apr 30, 2020
Last Update: Feb 07, 2020
Last Update: Feb 05, 2020
Last Update: Feb 05, 2020
Technical Documents
Application Notes (59)
Jun 26, 2020
Jun 26, 2020
Jun 26, 2020
Jun 26, 2020
Feb 19, 2018
Development Kits/Boards (7)
Jan 24, 2018
Software and Drivers (2)
Product Change Notice (PCN) (15)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
May 28, 2018
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
May 28, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation