CY8C29466-24PVXI | Cypress Semiconductor
CY8C29466-24PVXI
| Development Kit | CY3215-DK, CY3211-28SSOP |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | N |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | None |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 32 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 4 |
| No. of Dedicated UART | 4 |
| No. of GPIOs | 24 |
| No. of Programmable Analog Blocks | 12 |
| No. of Programmable Digital Blocks | 16 |
| SRAM (KB) | 2 |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $9.86 | $8.51 | $8.24 | $7.44 | $6.72 | $5.38 |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
235
Minimum Order Quantity (MOQ)
235
Order Increment
235
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Package Material Declaration
Last Update: Jun 25, 2019
IPC 1752 Material Declaration
Last Update: Jun 11, 2019
Last Update: Jun 06, 2019
Last Update: Mar 03, 2019
Last Update: Oct 13, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Application Notes (59)
Feb 19, 2018
Jan 29, 2018
Aug 26, 2015
Aug 26, 2015
Aug 18, 2015
Development Kits/Boards (8)
Jan 24, 2018
Software and Drivers (2)
Product Change Notice (PCN) (15)
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
May 28, 2018
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
May 28, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Product Information Notice (PIN) (3)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation