CY8C24794-24LQXI | Cypress Semiconductor

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CY8C24794-24LQXI
Status: Obsolete

Datasheet

(pdf, 2.13 MB) RoHS PB Free
(pdf, 2.04 MB) RoHS PB Free

CY8C24794-24LQXI

Development KitCY3214-PSoCEvalUSB
Automotive QualifiedN
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI, UART, USB
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of CapSense Channels1
No. of CapSense IO44
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs50
No. of Programmable Analog Blocks5
No. of Programmable Digital Blocks3
PWMsHW
Proximity SensingY
SRAM (KB)1
Sliders8
SmartSense EnabledN
Tape & ReelN
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.99 $3.82 $3.65 $3.49 $3.32 $3.04
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
56
Package Dimensions
275 L x 1 H x 275 W (Mils)
Package Weight
94.78 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (52)

Development Kits/Boards (2)

Product Change Notice (PCN) (4)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Advanced Product Change Notice (APCN) (1)

Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (2)

Apr 23, 2020
October 2018 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN183805 - October 2018 Product Obsolescence Notification

IBIS (1)

Mar 04, 2014