CY8C24223A-12PVXE | Cypress Semiconductor

CY8C24223A-12PVXE
Status: Obsolete

Datasheet

(pdf, 1.01 MB) RoHS PB Free

CY8C24223A-12PVXE

Development KitCY3215-DK, CY3208B-Pod
Automotive QualifiedY
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)125
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)4.75
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs16
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.36 $3.22 $3.08 $2.94 $2.80 $2.56
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 50 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
330
Minimum Order Quantity (MOQ)
330
Order Increment
330
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (53)

Development Kits/Boards (1)

Aug 29, 2018

Product Change Notice (PCN) (8)

May 06, 2020
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) as an alternate wafer fabrication site for Automotive PSoC CY8C24x23A Product Family
May 27, 2018
Shipping Label Upgrade
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (2)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Apr 14, 2020
January 2019 Product Obsolescence Notification

IBIS (1)

Jun 08, 2012