CY8C24123A-24SXI | Cypress Semiconductor
CY8C24123A-24SXI
| Development Kit | CY3215-DK |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | N |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | None |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 4 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 0 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 1 |
| No. of GPIOs | 6 |
| No. of Programmable Analog Blocks | 6 |
| No. of Programmable Digital Blocks | 4 |
| SRAM (KB) | 0.25 |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.01 | $2.60 | $2.52 | $2.27 | $2.06 | $1.64 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2425
Minimum Order Quantity (MOQ)
2425
Order Increment
2425
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
Last Update: Nov 10, 2016
Last Update: Nov 10, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 16, 2016
Technical Documents
Application Notes (53)
Aug 26, 2015
Aug 26, 2015
Aug 18, 2015
Development Kits/Boards (10)
Software and Drivers (2)
Product Change Notice (PCN) (18)
Jun 19, 2019
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C24X23 Device Family.
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of GSMC as an alternate wafer fabrication site for the PSoC CY8C24xx3A product family
May 27, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Product Information Notice (PIN) (3)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation