CY8C22545-24AXIT | Cypress Semiconductor
CY8C22545-24AXIT
| Development Kit | CY3215-DK, CY3207-Pod |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | SAR (1, 10-bit @ 192 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 16 |
| LCD Direct Drive | Y |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 0 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 2 |
| No. of Dedicated UART | 2 |
| No. of GPIOs | 38 |
| No. of Programmable Analog Blocks | 6 |
| No. of Programmable Digital Blocks | 8 |
| SRAM (KB) | 1 |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $6.86 | $5.93 | $5.74 | $5.18 | $4.68 | $3.74 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn
Marking
IPC 1752 Material Declaration
Technical Documents
Application Notes (26)
Jun 26, 2020
Jun 26, 2020
Development Kits/Boards (1)
Product Change Notice (PCN) (9)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Apr 14, 2020
Qualification of ASE Kaohsiung (ASE-KH) as an Additional Assembly Site for Select 44-Lead, 64-Lead and 100-Lead TQFP Pb-Free Products
May 28, 2018
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation