CY8C21512-12PVXE | Cypress Semiconductor

CY8C21512-12PVXE
Status: In Production

Datasheet

(pdf, 906.19 KB)

CY8C21512-12PVXE

Development KitCY3213A-DK
Automotive QualifiedY
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI, UART
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)125
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of CapSense Channels1
No. of CapSense IO20
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
No. of GPIOs24
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks1
PWMsHW
Proximity SensingY
SRAM (KB)0.5
Sliders4
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Contact Sales
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2350
Minimum Order Quantity (MOQ)
235
Order Increment
235
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (27)

Product Change Notice (PCN) (5)

May 06, 2020
Qualification of HHGrace Fab 3 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
May 06, 2020
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (3)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels