CY8C21434-24LTXI | Cypress Semiconductor
CY8C21434-24LTXI
| Development Kit | CY3213A-DK, CY3212-32QFN |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI, UART |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 8 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.40 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 24 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 28 |
| No. of Programmable Analog Blocks | 1 |
| No. of Programmable Digital Blocks | 3 |
| PWMs | HW |
| Proximity Sensing | Y |
| SRAM (KB) | 0.5 |
| Sliders | 4 |
| SmartSense Enabled | N |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.63 | $2.52 | $2.41 | $2.30 | $2.19 | $2.01 |
Packaging/Ordering
Package
No. of Pins
32
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
980
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: May 19, 2019
Package Qualification Report
Last Update: Sep 20, 2016
Last Update: Sep 19, 2016
Last Update: Aug 04, 2016
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 19, 2016
Last Update: Sep 15, 2016
Technical Documents
Application Notes (27)
Aug 26, 2015
Aug 26, 2015
Development Kits/Boards (9)
Software and Drivers (2)
Product Change Notice (PCN) (12)
May 29, 2018
Additional Products Qualified for 32-lead QFN (1.0 mm) Using the Saw Singulation Process at Cypress, Philippines
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32L Saw QFN Pb-free Package
May 28, 2018
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (7)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Oct 25, 2017
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
User Module Datasheets (42)
May 22, 2014