CY8C21434-24LQXIT | Cypress Semiconductor
CY8C21434-24LQXIT
| Development Kit | CY3213A-DK, CY3212-32QFN |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI, UART |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 8 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.40 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 24 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 28 |
| No. of Programmable Analog Blocks | 1 |
| No. of Programmable Digital Blocks | 3 |
| PWMs | HW |
| Proximity Sensing | Y |
| SRAM (KB) | 0.5 |
| Sliders | 4 |
| SmartSense Enabled | N |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.27 | $3.14 | $3.00 | $2.86 | $2.73 | $2.50 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.24 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Sep 19, 2016
Last Update: Sep 19, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 19, 2016
Last Update: Sep 15, 2016
Technical Documents
Application Notes (27)
Aug 26, 2015
Aug 26, 2015
Development Kits/Boards (9)
Software and Drivers (2)
Product Change Notice (PCN) (8)
May 28, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
May 28, 2018
Qualification of Carsem Malaysia as an Additional Assembly Site for 32-lead QFN (5X5X0.6 mm) Package Products Using the Saw Singulation Process
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (5)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
User Module Datasheets (42)
May 22, 2014