CY8C21345-24PVXAT | Cypress Semiconductor

CY8C21345-24PVXAT
Status: In Production

Datasheet

(pdf, 1.23 MB) RoHS PB Free

CY8C21345-24PVXAT

Development KitCY3215-DK
Automotive QualifiedY
CPU CoreM8C
CapSenseY
Dedicated ADC (No._ Max. Resolution @ Sample Rate)SAR (1, 10-bit @ 192 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveY
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs24
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks4
SRAM (KB)0.51
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.72 $3.56 $3.41 $3.25 $3.09 $2.83
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (26)

Development Kits/Boards (1)

Aug 29, 2018

Product Change Notice (PCN) (3)

May 06, 2020
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Qualification of Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
Apr 14, 2020
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Automotive Horizon Report Update
Apr 14, 2020
Q319 Automotive Horizon Report Update

Product Information Notice (PIN) (7)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
May 27, 2018
Datasheet changes to Automotive grade PSoC 1 products
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels