CY8C21312-12PVXET | Cypress Semiconductor
CY8C21312-12PVXET
| Development Kit | CY3213A-DK, CY3212-20SSOP |
| Automotive Qualified | Y |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI, UART |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 8 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 12 |
| Max. Operating Temp. (°C) | 125 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 12 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 16 |
| No. of Programmable Analog Blocks | 0 |
| No. of Programmable Digital Blocks | 1 |
| PWMs | HW |
| Proximity Sensing | Y |
| SRAM (KB) | 0.5 |
| Sliders | 2 |
| SmartSense Enabled | N |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.26 | $3.12 | $2.99 | $2.85 | $2.71 | $2.49 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Last Update: May 12, 2020
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 20, 2016
Technical Documents
Application Notes (27)
Jun 26, 2020
Jun 26, 2020
Product Change Notice (PCN) (5)
May 06, 2020
Qualification of HHGrace Fab 3 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for Select Automotive PSoC® 1 Products
May 06, 2020
Addendum to PCN171504 – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Addendum to PCN171504A – Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAu Leadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Apr 14, 2020
Qualification of Sumitomo G700LS Mold Compound and Roughened NiPdAuLeadframe for 20 and 28-Lead SSOP Automotive Packages Assembled at Amkor Philippines 1
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines