CY8C21123-24SXI | Cypress Semiconductor

CY8C21123-24SXI
Status: In Production

Datasheet

(pdf, 681.52 KB) RoHS PB Free
(pdf, 732.52 KB) RoHS PB Free

CY8C21123-24SXI

Development KitCY3215-DK, CY3213-8SOIC
Automotive QualifiedN
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs6
No. of Programmable Analog Blocks4
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.20 $1.90 $1.84 $1.66 $1.50 $1.20
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
3395
Minimum Order Quantity (MOQ)
3395
Order Increment
3395
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (33)

Development Kits/Boards (7)

Software and Drivers (2)

Product Change Notice (PCN) (17)

Jun 19, 2019
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
May 28, 2018
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21x23 Device Family
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
PSoC Product Datasheet Changes
May 28, 2018
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21x23 Device Family
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for PSoC CY8C21x23 product family on SONOS4 technology
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

May 27, 2018
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (2)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (42)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012