CY8C20347S-24LQXI | Cypress Semiconductor
CY8C20347S-24LQXI
| Development Kit | CY3280-20xx7 |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 16 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 1.71 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 17 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 20 |
| No. of Programmable Analog Blocks | 0 |
| No. of Programmable Digital Blocks | 0 |
| PWMs | SW |
| Part Family | Standard Sync |
| Proximity Sensing | Y |
| SRAM (KB) | 2 |
| Sliders | 3 |
| SmartSense Enabled | Y |
| Tape & Reel | N |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $3.05 | $2.92 | $2.79 | $2.66 | $2.53 | $2.32 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 19, 2016
Technical Documents
Application Notes (6)
Development Kits/Boards (1)
Product Change Notice (PCN) (4)
Dec 02, 2020
Qualification of Greatek Electronic as an Additional Assembly Site for Select 24-Lead QFN Pb-Free Products
Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families