CY8C20346AS-24LQXI | Cypress Semiconductor
CY8C20346AS-24LQXI
Automotive Qualified | N |
CPU Core | M8C |
CapSense | Y |
Comm. Interface | I2C, SPI |
Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
Flash (KB) | 16 |
LCD Direct Drive | N |
Max. Operating Frequency (MHz) | 24 |
Max. Operating Temp. (°C) | 85 |
Max. Operating Voltage (V) | 5.50 |
Min. Operating Temp. (°C) | -40 |
Min. Operating Voltage (V) | 1.71 |
No. of CapSense Channels | 1 |
No. of CapSense IO | 17 |
No. of Dedicated Comparators | 0 |
No. of Dedicated I2C | 1 |
No. of Dedicated OpAmps | 0 |
No. of Dedicated SPI | 1 |
No. of Dedicated UART | 0 |
No. of GPIOs | 20 |
No. of Programmable Analog Blocks | 0 |
No. of Programmable Digital Blocks | 0 |
PWMs | SW |
Proximity Sensing | N |
SRAM (KB) | 2 |
Sliders | 3 |
SmartSense Enabled | Y |
Tape & Reel | N |
USB (Type) | None |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$2.50 | $2.40 | $2.29 | $2.19 | $2.08 | $1.91 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
28
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Package Qualification Report
Last Update: Sep 19, 2016
Last Update: Aug 07, 2015
QTP 92103 Automotive 56-Lead QFN (Quad Flat No-Lead) Pure Sn, MSL3, 260C Reflow, Amkor-Korea (L).pdf
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 18, 2016
Last Update: Aug 31, 2015
Technical Documents
Application Notes (5)
Product Change Notice (PCN) (2)
Product Information Notice (PIN) (3)
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families