CY8C20334-12LQXI | Cypress Semiconductor

CY8C20334-12LQXI
Status: In Production

Datasheet

(pdf, 848.78 KB) RoHS PB Free
(pdf, 936.99 KB) RoHS PB Free

CY8C20334-12LQXI

Development KitCY3203A-DK
Automotive QualifiedN
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO17
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs20
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)0.5
Sliders3
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.97 $1.89 $1.81 $1.73 $1.64 $1.50
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Qualification Report

Device Qualification Reports

Technical Documents

Technical Reference Manuals (1)

Application Notes (18)

Development Kits/Boards (2)

Software and Drivers (2)

Product Change Notice (PCN) (11)

Oct 16, 2019
May 29, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
PSoC Product Datasheet Changes
May 28, 2018
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Apr 22, 2010
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process

Advanced Product Change Notice (APCN) (2)

Dec 04, 2019
Jul 21, 2019

Product Information Notice (PIN) (5)

Jan 07, 2020
Dec 21, 2019
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (13)

IBIS (1)

Mar 04, 2014

Technical Articles (3)