CY8C20324-12LQXI | Cypress Semiconductor

CY8C20324-12LQXI
Status: In Production

Datasheet

(pdf, 1.09 MB) RoHS PB Free

CY8C20324-12LQXI

Development KitCY3203A-DK
Automotive QualifiedN
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO17
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs17
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)0.5
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.17 $2.08 $1.99 $1.90 $1.81 $1.66
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4900
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Product Change Notice (PCN) (7)

Apr 23, 2020
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines
May 29, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
May 28, 2018
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Apr 22, 2010
Qualification of Carsem Malaysia as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm) Package Products Using the Saw Singulation Process