CY8C20234-12LKXIT | Cypress Semiconductor
CY8C20234-12LKXIT
| Development Kit | CY3203A-DK |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 8 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 12 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.40 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 10 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 13 |
| No. of Programmable Digital Blocks | 0 |
| PWMs | SW |
| Proximity Sensing | N |
| SRAM (KB) | 0.5 |
| SmartSense Enabled | N |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $1.77 | $1.70 | $1.62 | $1.55 | $1.48 | $1.35 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au/Ag;Pure Sn
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Technical Documents
Technical Reference Manuals (1)
Application Notes (18)
Jun 26, 2020
Development Kits/Boards (2)
Software and Drivers (2)
Product Change Notice (PCN) (9)
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 16-Lead QFN Pb - Free package assembled in Amkor-Phil
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (7)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation