CY8C20234-12LKXIT | Cypress Semiconductor
CY8C20234-12LKXIT
| Development Kit | CY3203A-DK |
| Automotive Qualified | N |
| CPU Core | M8C |
| CapSense | Y |
| Comm. Interface | I2C, SPI |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | DelSig (1, 10-bit @ 5.9 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 8 |
| LCD Direct Drive | N |
| Max. Operating Frequency (MHz) | 12 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.40 |
| No. of CapSense Channels | 1 |
| No. of CapSense IO | 10 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 1 |
| No. of Dedicated UART | 0 |
| No. of GPIOs | 13 |
| No. of Programmable Digital Blocks | 0 |
| PWMs | SW |
| Proximity Sensing | N |
| SRAM (KB) | 0.5 |
| Sliders | 2 |
| SmartSense Enabled | N |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $1.77 | $1.70 | $1.62 | $1.55 | $1.48 | $1.35 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
16 - QFN (3 X 3 X 0.6 MM) CHIP ON LEADS (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Last Update: May 30, 2017
IPC 1752 Material Declaration
Last Update: Aug 17, 2017
Last Update: Oct 14, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Sep 19, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Technical Documents
Technical Reference Manuals (1)
Application Notes (18)
Aug 26, 2015
Development Kits/Boards (2)
Software and Drivers (2)
Product Change Notice (PCN) (9)
May 28, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the PSoC CY8C20xx4 product family
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 16-Lead QFN Pb - Free package assembled in Amkor-Phil
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Product Information Notice (PIN) (4)
Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation